IC Packages

Information about our different ICs packages

Packaging Technologies

Packaging technology can significantly influence the performance of power semiconductors. Especially in the case of components with a high power dissipation such as motor drivers, a perfect thermal design is mandatory and allows for highest performance and lifetime.

Downloads

Package Breakout Boards

These are simple package breakout boards without any other functionality.

The format is AutoCAD EAGLE. It contains schematics and layout for each package.

The designs are provided "as is".

Downloads Package Breakout Boards

File
Type
Size
Date
QFN28-5x5mm.zip 28 KBJun 22, 2017 8:14 AM
QFN32-4x4mm.zip 28 KBJun 22, 2017 8:14 AM
QFN32-5x5mm.zip 26 KBJun 22, 2017 8:14 AM
QFN32-7x7mm.zip 26 KBJun 22, 2017 8:14 AM
QFN36-5x6mm.zip 25 KBJun 22, 2017 8:14 AM
QFN40-6x6mm.zip 25 KBJun 22, 2017 8:14 AM
QFN48-7x7mm.zip 26 KBJun 22, 2017 8:14 AM